super bright round type led lamps data sheet doc. no : qw0905-LURF2043-PF rev. : a date : 16 - jan. - 2007 LURF2043-PF pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
25% 100% 75%50%25%0 -60 -30 0 50%75%100% 60 30 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only 25.0min 4.0 3.0 1.0min 5.2 1.5max 2.54typ directivity radiation + - 0.5 typ 4.2 part no. LURF2043-PF package dimensions page 1/5
t opr operating temperature -40 ~ +85 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) red material part no LURF2043-PF algainp storage temperature spectral halfwidth nm forward voltage @20ma(v) viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm water clear emitted lens 630202.4 max. 1.5 min. 700 min. 30 1100 typ. -40 ~ +100 color tstg absolute maximum ratings at ta=25 electrostatic discharge( * ) forward current reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter page 2/5 2000 ratings i f esd ir pd i fp symbol ma 50 10 120 130 a v ma mw urf unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LURF2043-PF
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 wavelength (nm) 550 0 700 650 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) fig.5 relative intensity vs. wavelength 1.0 ambient temperature( ) 0.8 -0 -20 -4060 40 2080100 0 -40-20-060 4080100 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 100 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 1.5 1.0 0.1 2.5 2.03.01.010 0 1.0 10 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 1000 3.5 2.5 typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 3.0 urf chip 3/5 page part no. LURF2043-PF
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 260 120 25 temp( c) time(sec) 150 2 /sec max 60 seconds max preheat 0 0 50 100 5 /sec max 260 c3sec max 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) page 4/5 ligitek electronics co.,ltd. property of ligitek only part no. LURF2043-PF
1.t.sol=230 5 2.dwell time=5 1sec thermal shock test solder resistance test solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature storage test low temperature storage test high temperature high humidity test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test item operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description ligitek electronics co.,ltd. property of ligitek only page 5/5 part no. LURF2043-PF
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